eISSN: 2299-551X
ISSN: 0011-4553
Journal of Stomatology
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vol. 77
Original paper

Micro-computed tomographic assessment of the influence of light-curing modes on internal void formation in bulk-fill composites

Özge Gizem Yenidünya
Tuğba Misilli
Mert Ocak

  1. Department of Restorative Dentistry, Pamukkale University, Faculty of Dentistry, Turkey
  2. Department of Restorative Dentistry, Çanakkale Onsekiz Mart University, Faculty of Dentistry, Turkey
  3. Department of Basic Medical Sciences, Ankara University, Faculty of Dentistry, Turkey
J Stoma 2024; 77, 2: 110-117
Online publish date: 2024/05/29
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Polymerization reactions in a new generation bulk-fill composites carried out in a short time with high irradiation, raise concerns about curing processes. With micro-computed tomographic evaluation, it is possible to investigate polymerization shrinkage, and subsequent gap and void formation in dental materials.

The aim of this study was to evaluate the void formation in bulk-fill composites light-cured with different modes using micro-computed tomography.

Material and methods:
Class I preparations were made in 25 molars that were randomly divided into sub-groups, according to resin composite and curing mode used: Tetric EvoCeram (TEC)*high power mode, TEC*turbo mode, Tetric PowerFill (TPF)*high power mode, TPF*turbo mode, and TPF*3s mode. Each tooth was scanned at two time intervals: pre- and post-cure.

After light-curing, a significant increase in the total volume of internal void was noted for both composites cured with high power mode compared with pre-cure. The difference between the sub-groups at post-cure was also significant. While TEC exhibited similar values in terms of different curing modes, turbo and 3s modes caused a significant difference in TPF group, and the lowest void percentage was detected in 3s mode.

Internal void formation results from an interplay of different factors, including composition of materials and curing modes.


bulk-fill resin composite, light-curing mode, micro-computed tomography, void formation

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